Semiconductor Wafer Lapper from Mexico
Machine that lap-grinds both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness. Classified under HTS 8479.89.95.99 as wafer preparation equipment per statistical note (a)(ii)(C). Prepares wafers for final polishing and fabrication.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide TTV (total thickness variation) specs (<0.5 microns typical) to prove semiconductor precision
• Include slurry handling systems documentation showing CMP compatibility
• Avoid misclassification as general lapping machines by specifying 200-450mm wafer carriers