Semiconductor Wafer Lapper from Japan
Machine that lap-grinds both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness. Classified under HTS 8479.89.95.99 as wafer preparation equipment per statistical note (a)(ii)(C). Prepares wafers for final polishing and fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide TTV (total thickness variation) specs (<0.5 microns typical) to prove semiconductor precision
• Include slurry handling systems documentation showing CMP compatibility
• Avoid misclassification as general lapping machines by specifying 200-450mm wafer carriers