Semiconductor Wafer Lapper from China
Machine that lap-grinds both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness. Classified under HTS 8479.89.95.99 as wafer preparation equipment per statistical note (a)(ii)(C). Prepares wafers for final polishing and fabrication.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide TTV (total thickness variation) specs (<0.5 microns typical) to prove semiconductor precision
• Include slurry handling systems documentation showing CMP compatibility
• Avoid misclassification as general lapping machines by specifying 200-450mm wafer carriers