Gallium Arsenide Wafer Slicer from Mexico
Specialized saw for slicing fragile gallium arsenide wafers from boules, using wire or blade tech optimized for compound semiconductors. HTS 8479.89.95.99 per statistical notes covering GaAs processing. Prevents cracking in brittle III-V materials.
Duty Rate — Mexico → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Highlight GaAs-specific blade tensioning and coolant chemistry to avoid silicon-only classification
• Include fragility handling specs (thinner kerf, slower feeds) distinguishing from silicon saws
• Document RF/microwave device end-use to justify compound semiconductor placement