Gallium Arsenide Wafer Slicer from Japan
Specialized saw for slicing fragile gallium arsenide wafers from boules, using wire or blade tech optimized for compound semiconductors. HTS 8479.89.95.99 per statistical notes covering GaAs processing. Prevents cracking in brittle III-V materials.
Duty Rate — Japan → United States
17.5%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Highlight GaAs-specific blade tensioning and coolant chemistry to avoid silicon-only classification
• Include fragility handling specs (thinner kerf, slower feeds) distinguishing from silicon saws
• Document RF/microwave device end-use to justify compound semiconductor placement