Double-Sided Wafer Polisher from Germany
Automated polisher using chemical-mechanical planarization to achieve mirror-finish flatness on both wafer surfaces for semiconductor device fabrication. HTS 8479.89.95.99 for wafer preparation polishers per statistical notes. Removes subsurface damage from lapping.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Detail polishing pads, slurries, and pressure controls specific to silicon/gallium arsenide
• Include cleanroom class 1 compatibility and deionized water requirements