Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8479.89.95.99 as wafer preparation equipment per statistical notes. Critical step before slicing in semiconductor fabrication.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include metrology specs (tolerances <1 micron) and flat grinding capabilities in entry docs to prove semiconductor specificity
• Comply with cleanroom compatibility certifications for dust-free operation in fab environments