Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8479.89.95.99 as wafer preparation equipment per statistical notes. Critical step before slicing in semiconductor fabrication.
Duty Rate — Japan → United States
17.5%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include metrology specs (tolerances <1 micron) and flat grinding capabilities in entry docs to prove semiconductor specificity
• Comply with cleanroom compatibility certifications for dust-free operation in fab environments