Crystal Boule Grinder from Germany
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8479.89.95.99 as wafer preparation equipment per statistical notes. Critical step before slicing in semiconductor fabrication.
Duty Rate — Germany → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include metrology specs (tolerances <1 micron) and flat grinding capabilities in entry docs to prove semiconductor specificity
• Comply with cleanroom compatibility certifications for dust-free operation in fab environments