Velonix Wafer Ultrasonic Cleaner from Japan
Industrial ultrasonic cleaning system for semiconductor wafers post-slicing, featuring megasonic transducers for sub-micron particle removal. Classified under HTS 8479.89.95.85 for its role in wafer preparation equipment within semiconductor processing. It prepares surfaces to exact flatness specs before fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide evidence of use in Czochralski boule processing via user manuals to justify semiconductor classification
• Ensure EPA compliance for chemical-free cleaning claims to prevent environmental duty surcharges