Velonix Wafer Ultrasonic Cleaner from Japan
Industrial ultrasonic cleaning system for semiconductor wafers post-slicing, featuring megasonic transducers for sub-micron particle removal. Classified under HTS 8479.89.95.85 for its role in wafer preparation equipment within semiconductor processing. It prepares surfaces to exact flatness specs before fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide evidence of use in Czochralski boule processing via user manuals to justify semiconductor classification
• Ensure EPA compliance for chemical-free cleaning claims to prevent environmental duty surcharges