Semix Ultrasonic Crystal Grinder Cleaner from Japan
Post-grinding ultrasonic cleaner for semiconductor crystal boules, ensuring flats indicate conductivity without surface damage. Under HTS 8479.89.95.85 per notes for crystal grinder adjuncts in wafer manufacturing. Prepares boules for precise slicing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document integration with crystal pullers (Czochralski method) to support statistical note classification
• Use NAICS 334413 for valuation to align with semiconductor manufacturing importers
• Avoid misdeclaration as float zone equipment, which may alter specifics