Aquanomics Megasonic Wafer Tank from Japan
Megasonic ultrasonic cleaning station for lapping and polishing semiconductor wafers, removing residues to achieve mirror-flat surfaces. It qualifies for HTS 8479.89.95.85 as specialized apparatus in the statistical note for wafer preparation equipment. Critical for dimensional tolerances in chip fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Label with precise frequency (e.g
• 1 MHz megasonic) and wafer size compatibility (200-300mm) for accurate HTS verification
• Obtain advance ruling from CBP on semiconductor vs. general use to avoid delays at ports