Fuji NXT III High-Precision Chip Mounter

Fuji's NXT III series provides ultra-precise component placement for fine-pitch ICs and BGAs in high-density PCB assembly. The modular design allows scalability from prototyping to mass production. Falls under HTS 8479.89.92.00 due to its principal use in printed circuit assembly manufacturing.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8479.50.00Higher: 37.5% vs 35%

If primarily used for semiconductor wafer processing

Wafer-level placement equipment relates to Chapter 84 semiconductor notes rather than PCB assembly

9031.49Lower: 10% vs 35%

If includes advanced optical inspection systems as primary function

Machines where inspection/measurement dominates over placement classified in Chapter 90

8479.89Same rate: 35%

If sold as complete SMT production line sets

Assembled production lines with multiple functions may fall under different assembly machine provisions

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Import Tips & Compliance

Provide PCB assembly line layout diagrams showing integration with reflow ovens and screen printers,Ensure FDA registration if destined for medical device manufacturing facilities,Document component size range and placement accuracy specs to confirm PCB-specific classification