ASM SIPLACE E by DIEHL METAL
The SIPLACE E series offers cost-effective high-speed placement for mid-volume PCB production with excellent flexibility for component changes. Designed specifically for printed circuit assembly lines. HTS 8479.89.92.00 classification reflects its principal PCB manufacturing function.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for die placement in semiconductor packaging
Die attach equipment for chip-on-board applications has specific semiconductor provisions
If configured for continuous material handling
Bucket-type placement for bulk components uses different handling equipment classification
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Import Tips & Compliance
• Demonstrate machine throughput rates typical for PCB assembly (20,000+ CPH),Include feeder compatibility lists confirming SMT component standards,Customs may require proof of exclusion from wafer/die handling applications
Related Products under HTS 8479.89.92.00
Fuji NXT III High-Precision Chip Mounter
Fuji's NXT III series provides ultra-precise component placement for fine-pitch ICs and BGAs in high-density PCB assembly. The modular design allows scalability from prototyping to mass production. Falls under HTS 8479.89.92.00 due to its principal use in printed circuit assembly manufacturing.
Panasonic NPM-DX Multifunctional Mounter
The Panasonic NPM-DX handles both high-speed chip placement and precision odd-form component mounting for diverse PCB assembly needs. It features intelligent feeders and automatic changeover systems. Classified in HTS 8479.89.92.00 for dedicated printed circuit assembly applications.
Hanwha Decan S2 Flexible Mounter
Hanwha's Decan S2 provides versatile placement for high-mix, low-volume PCB production with rapid program changeovers. Supports 01005 microchips through large connectors. Dedicated PCB assembly equipment qualifying for HTS 8479.89.92.00.
Yamaha YSM20 High-Speed Modular Surface Mounter
The Yamaha YSM20 is an automated pick-and-place machine designed for high-speed placement of electronic components onto printed circuit boards during PCB assembly. It features advanced vision systems and supports component sizes from 0201 chips to large odd-form parts. Classified under HTS 8479.89.92.00 as it is used solely for manufacturing printed circuit assemblies.