Semiconductor Wafer Lapper from Germany
Electromechanical lapping machine with self-contained motor that uses loose abrasive slurry on cast iron plates to achieve sub-micron flatness on semiconductor wafer surfaces prior to polishing. Critical for bringing wafers within tight dimensional tolerances. HTS 8479.89.65.00 for wafer preparation equipment.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include flatness specification data (bow/warp <1μm) confirming semiconductor use
• Classify slurry pumps separately if modular to avoid integral machine valuation
• Certify lapping plates meet semiconductor contamination standards (ultra-pure cast iron)