Semiconductor Wafer Lapper from Germany
Electromechanical lapping machine with self-contained motor that uses loose abrasive slurry on cast iron plates to achieve sub-micron flatness on semiconductor wafer surfaces prior to polishing. Critical for bringing wafers within tight dimensional tolerances. HTS 8479.89.65.00 for wafer preparation equipment.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Section 232: ag equipment + residential HVAC, MFN<15% — 15% ceiling (Annex III addition)
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include flatness specification data (bow/warp <1μm) confirming semiconductor use
• Classify slurry pumps separately if modular to avoid integral machine valuation
• Certify lapping plates meet semiconductor contamination standards (ultra-pure cast iron)