Semiconductor Wafer Lapper from China
Electromechanical lapping machine with self-contained motor that uses loose abrasive slurry on cast iron plates to achieve sub-micron flatness on semiconductor wafer surfaces prior to polishing. Critical for bringing wafers within tight dimensional tolerances. HTS 8479.89.65.00 for wafer preparation equipment.
Duty Rate — China → United States
22.5%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.82.1015%Section 232: ag equipment + residential HVAC, MFN<15% — 15% ceiling (Annex III addition)
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include flatness specification data (bow/warp <1μm) confirming semiconductor use
• Classify slurry pumps separately if modular to avoid integral machine valuation
• Certify lapping plates meet semiconductor contamination standards (ultra-pure cast iron)