Semiconductor Wafer Lapper from China
Electromechanical lapping machine with self-contained motor that uses loose abrasive slurry on cast iron plates to achieve sub-micron flatness on semiconductor wafer surfaces prior to polishing. Critical for bringing wafers within tight dimensional tolerances. HTS 8479.89.65.00 for wafer preparation equipment.
Duty Rate — China → United States
20.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Include flatness specification data (bow/warp <1μm) confirming semiconductor use
• Classify slurry pumps separately if modular to avoid integral machine valuation
• Certify lapping plates meet semiconductor contamination standards (ultra-pure cast iron)