CIM-SIP Cold Isostatic Press
The CIM-SIP is a wet-bag cold isostatic pressing system used to uniformly compact powdered materials like ceramics and metals into high-density green compacts at ambient temperatures. It applies hydrostatic pressure up to 400 MPa using a liquid medium, making it ideal for producing complex-shaped prototypes and small production runs in semiconductor manufacturing. Classified under HTS 8479.83.00.00 as it is specifically a cold isostatic press for material densification.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not strictly isostatic or used for non-press functions
Other mechanical appliances not specifically enumerated fall under general other machines category.
If for high-temperature hot isostatic pressing
Hot isostatic presses operate above ambient temps and classify under machinery for working metals.
If imported as replacement parts only
Parts of cold isostatic presses classify separately from complete machines.
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Import Tips & Compliance
• Verify machine specs confirm isostatic pressure application at ambient temps; provide manufacturer datasheet for customs
• Include end-use certification if for semiconductor processing to qualify for potential duty relief programs
• Ensure pressure vessel complies with ASME codes; common pitfall is missing hydrostatic test documentation
Related Products under HTS 8479.83.00.00
Kipac Cold Isostatic Press Model 500
Kipac Model 500 is a high-pressure cold isostatic press designed for densifying semiconductor-grade silicon carbide powders into near-net-shape components. Operating at pressures up to 500 MPa in a flexible mold submerged in fluid, it eliminates die-wall friction for uniform density crucial in wafer substrate production. Falls under HTS 8479.83.00.00 as a dedicated cold isostatic pressing machine.
Quintus Technologies QIP 73L Cold Isostatic Press
Quintus QIP 73L is a production-scale cold isostatic press with 73-liter chamber capacity for high-throughput compaction of semiconductor metal powders like tungsten carbide for tooling. Delivers uniform 600 MPa pressure via water medium at ambient temps for superior green strength. HTS 8479.83.00.00 designation for cold isostatic presses.
EPSI Tri-Axial Cold Isostatic Press
EPSI's tri-axial cold isostatic press uses three-dimensional pressure application for producing large-diameter semiconductor ceramic tubes and rods from powders. It achieves 200-600 MPa hydrostatic compaction at room temperature, essential for consistent microstructures in GaAs device substrates. HTS 8479.83.00.00 covers this specialized isostatic compaction equipment.
Bodycote HIP Cold Isostatic Press CIP-1000
Bodycote's CIP-1000 series cold isostatic press handles large-volume production of semiconductor-grade alumina and sapphire green bodies up to 1000 mm diameter. Using oil as pressure medium at 400 MPa ambient temperature, it ensures void-free compaction for subsequent sintering into optical and substrate materials. Specifically classified as cold isostatic presses under HTS 8479.83.00.00.