Wafer Lapping Machine from Mexico
Precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. Classified in HTS 8479.82.00 for grinding/lapping functions in wafer preparation for device fabrication.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify lapping to SEMI M1 standards (total thickness variation <0.5μm) for proper classification
• Declare slurry mixing and circulation systems as integral to lapping process