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8479.82.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. Classified in HTS 8479.82.00 for grinding/lapping functions in wafer preparation for device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Certify lapping to SEMI M1 standards (total thickness variation <0.5μm) for proper classification

• Declare slurry mixing and circulation systems as integral to lapping process

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8479.82.00