Wafer Lapping Machine from Canada
Precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. Classified in HTS 8479.82.00 for grinding/lapping functions in wafer preparation for device fabrication.
Duty Rate — Canada → United States
60%
Rate breakdown
9903.03.1450%Articles the product of Canada as provided in subdivision (b)(3) of U.S. note 51 to this subchapter
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify lapping to SEMI M1 standards (total thickness variation <0.5μm) for proper classification
• Declare slurry mixing and circulation systems as integral to lapping process