Wafer Lapping Machine from Canada
Precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. Classified in HTS 8479.82.00 for grinding/lapping functions in wafer preparation for device fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Certify lapping to SEMI M1 standards (total thickness variation <0.5μm) for proper classification
• Declare slurry mixing and circulation systems as integral to lapping process