8479.82.00/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Double-sided polishing machine that creates mirror-finish surfaces on semiconductor wafers critical for subsequent fabrication processes. Under HTS 8479.82.00 as polishing equipment for wafer surface preparation per chapter statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify polishing to <1Å RMS surface roughness to distinguish from general polishers

• Include wafer carrier and platen specs proving 200-450mm wafer compatibility