Semiconductor Wafer Polisher from Canada
Double-sided polishing machine that creates mirror-finish surfaces on semiconductor wafers critical for subsequent fabrication processes. Under HTS 8479.82.00 as polishing equipment for wafer surface preparation per chapter statistical notes.
Duty Rate — Canada → United States
60%
Rate breakdown
9903.03.1450%Articles the product of Canada as provided in subdivision (b)(3) of U.S. note 51 to this subchapter
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify polishing to <1Å RMS surface roughness to distinguish from general polishers
• Include wafer carrier and platen specs proving 200-450mm wafer compatibility