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8479.82.00/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. Falls under HTS 8479.82.00 as grinding apparatus for semiconductor material processing as defined in statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Provide boule diameter specs (150-450mm typical) matching industry standards to validate classification

• Include photos/drawings of flat-grinding mechanism specific to dopant orientation marking

Crystal Boule Grinder from Japan — Import Duty Rate | HTS 8479.82.00