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8479.82.00.80/Wafer Edge Grinding Machine/Japan

Wafer Edge Grinding Machine from Japan

Specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. Classified 8479.82.0080 for semiconductor wafer preparation grinding.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify edge profile tolerances (45° chamfer typical) and wafer diameter range

• Include handling system specs for thin wafer processing capability