Wafer Edge Grinding Machine from Japan
Specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. Classified 8479.82.0080 for semiconductor wafer preparation grinding.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profile tolerances (45° chamfer typical) and wafer diameter range
• Include handling system specs for thin wafer processing capability