Wafer Edge Grinding Machine from Germany
Specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. Classified 8479.82.0080 for semiconductor wafer preparation grinding.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify edge profile tolerances (45° chamfer typical) and wafer diameter range
• Include handling system specs for thin wafer processing capability