8479.82.00.80/Silicon Ingot Slicing Saw/Japan

Silicon Ingot Slicing Saw from Japan

High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify kerf loss specs (<200μm typical) and blade specifications

• Include ingot diameter capacity and slicing angle precision data

• Avoid misclassification as general saw under 8461