Silicon Ingot Slicing Saw from Japan
High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify kerf loss specs (<200μm typical) and blade specifications
• Include ingot diameter capacity and slicing angle precision data
• Avoid misclassification as general saw under 8461