Silicon Ingot Slicing Saw from Germany
High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify kerf loss specs (<200μm typical) and blade specifications
• Include ingot diameter capacity and slicing angle precision data
• Avoid misclassification as general saw under 8461