Silicon Ingot Slicing Saw from Germany
High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify kerf loss specs (<200μm typical) and blade specifications
• Include ingot diameter capacity and slicing angle precision data
• Avoid misclassification as general saw under 8461