Silicon Ingot Slicing Saw from Canada
High-precision inner diameter (ID) saw for slicing semiconductor ingots into thin wafers with minimal material loss. Classified under 8479.82.0080 as wafer manufacturing slicing equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify kerf loss specs (<200μm typical) and blade specifications
• Include ingot diameter capacity and slicing angle precision data
• Avoid misclassification as general saw under 8461