Semiconductor Wafer Lapping Machine from Japan
Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document flatness specs (typically <1μm) and slurry composition for proper classification
• Include wafer thickness uniformity data in technical specifications