8479.82.00.80/Semiconductor Wafer Lapping Machine/Japan

Semiconductor Wafer Lapping Machine from Japan

Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document flatness specs (typically <1μm) and slurry composition for proper classification

• Include wafer thickness uniformity data in technical specifications