Semiconductor Wafer Lapping Machine from Japan
Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flatness specs (typically <1μm) and slurry composition for proper classification
• Include wafer thickness uniformity data in technical specifications