8479.82.00.80/Semiconductor Wafer Lapping Machine/Germany

Semiconductor Wafer Lapping Machine from Germany

Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Document flatness specs (typically <1μm) and slurry composition for proper classification

• Include wafer thickness uniformity data in technical specifications