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8479.82.00.80/Semiconductor Wafer Lapping Machine/Canada

Semiconductor Wafer Lapping Machine from Canada

Machine that lap semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. Falls under 8479.82.0080 as specialized wafer preparation grinding equipment.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Document flatness specs (typically <1μm) and slurry composition for proper classification

• Include wafer thickness uniformity data in technical specifications