Gallium Arsenide Wafer Grinder from Japan
Specialized grinder for compound semiconductor wafers like GaAs, handling brittle materials with unique back-grinding requirements. 8479.82.0080 per statistical notes for semiconductor processing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document GaAs-specific parameters like grinding wheel composition
• Include thin wafer handling (<100μm) capability specs