8479.82.00.80/Gallium Arsenide Wafer Grinder/Japan

Gallium Arsenide Wafer Grinder from Japan

Specialized grinder for compound semiconductor wafers like GaAs, handling brittle materials with unique back-grinding requirements. 8479.82.0080 per statistical notes for semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document GaAs-specific parameters like grinding wheel composition

• Include thin wafer handling (<100μm) capability specs