Diamond Wafer Polishing System from Mexico
Chemical mechanical polishing (CMP) system using diamond abrasives to achieve mirror finish on semiconductor wafers for device fabrication. 8479.82.0080 as specialized wafer grinding/polishing apparatus.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document removal rate specs and surface roughness (Ra <0.2nm typical)
• Include chemical slurry compatibility certification