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8479.82.00.80/Diamond Wafer Polishing System/Mexico

Diamond Wafer Polishing System from Mexico

Chemical mechanical polishing (CMP) system using diamond abrasives to achieve mirror finish on semiconductor wafers for device fabrication. 8479.82.0080 as specialized wafer grinding/polishing apparatus.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document removal rate specs and surface roughness (Ra <0.2nm typical)

• Include chemical slurry compatibility certification