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8479.82.00.80/Diamond Wafer Polishing System/Japan

Diamond Wafer Polishing System from Japan

Chemical mechanical polishing (CMP) system using diamond abrasives to achieve mirror finish on semiconductor wafers for device fabrication. 8479.82.0080 as specialized wafer grinding/polishing apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document removal rate specs and surface roughness (Ra <0.2nm typical)

• Include chemical slurry compatibility certification