Diamond Wafer Polishing System from Canada
Chemical mechanical polishing (CMP) system using diamond abrasives to achieve mirror finish on semiconductor wafers for device fabrication. 8479.82.0080 as specialized wafer grinding/polishing apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document removal rate specs and surface roughness (Ra <0.2nm typical)
• Include chemical slurry compatibility certification