Diamond Wafer Polishing System from Canada
Chemical mechanical polishing (CMP) system using diamond abrasives to achieve mirror finish on semiconductor wafers for device fabrication. 8479.82.0080 as specialized wafer grinding/polishing apparatus.
Duty Rate — Canada → United States
60%
Rate breakdown
9903.03.1450%Articles the product of Canada as provided in subdivision (b)(3) of U.S. note 51 to this subchapter
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document removal rate specs and surface roughness (Ra <0.2nm typical)
• Include chemical slurry compatibility certification