8479.82.00.80/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Meets 8479.82.0080 as wafer preparation grinding equipment per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include boule diameter tolerance specs (typically ±0.1mm) and flat grinding angle documentation

• Certify for monocrystalline silicon/gallium arsenide use to qualify under semiconductor provisions