Wafer Slicing Diamond Saw from Mexico
Diamond wire or blade saws slice thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8479.30.00.00 covers this under statistical note (a)(ii)(B) for wafer slicing equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify diamond wire tensioning system meets statistical note specifications for kerf control
• Comply with vibration standards for sub-micron slicing accuracy