8479.30.00.00/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

Diamond wire or blade saws slice thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8479.30.00.00 covers this under statistical note (a)(ii)(B) for wafer slicing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify diamond wire tensioning system meets statistical note specifications for kerf control

• Comply with vibration standards for sub-micron slicing accuracy