8479.30.00.00/Semiconductor Wafer Lapper/Japan

Semiconductor Wafer Lapper from Japan

Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Document lapping plate flatness specs (e.g

• <1μm across 300mm wafer)

• Ensure slurry handling system designed for colloidal silica, not general abrasives

• Avoid pitfall of classifying as general metal lapping machines