Semiconductor Wafer Lapper from Japan
Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document lapping plate flatness specs (e.g
• <1μm across 300mm wafer)
• Ensure slurry handling system designed for colloidal silica, not general abrasives
• Avoid pitfall of classifying as general metal lapping machines