8479.30.00.00/Semiconductor Wafer Lapper/Japan

Semiconductor Wafer Lapper from Japan

Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document lapping plate flatness specs (e.g

• <1μm across 300mm wafer)

• Ensure slurry handling system designed for colloidal silica, not general abrasives

• Avoid pitfall of classifying as general metal lapping machines