Semiconductor Wafer Lapper from Germany
Wafer lappers use loose abrasives to achieve initial flatness on semiconductor wafers before polishing. Classified HTS 8479.30.00.00 per statistical note (a)(ii)(C) for wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document lapping plate flatness specs (e.g
• <1μm across 300mm wafer)
• Ensure slurry handling system designed for colloidal silica, not general abrasives
• Avoid pitfall of classifying as general metal lapping machines