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8479.30.00.00/Sapphire Wafer Preparation Grinder/Japan

Sapphire Wafer Preparation Grinder from Japan

Grinds synthetic sapphire boules for LED/HB-LED wafer production. Statistical notes cover semiconductor materials processing including sapphire substrates.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify sapphire c-plane orientation grinding capability

• Higher hardness requires specialized diamond tooling documentation