Sapphire Wafer Preparation Grinder from Japan
Grinds synthetic sapphire boules for LED/HB-LED wafer production. Statistical notes cover semiconductor materials processing including sapphire substrates.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify sapphire c-plane orientation grinding capability
• Higher hardness requires specialized diamond tooling documentation