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8479.30.00.00/Sapphire Wafer Preparation Grinder/Germany

Sapphire Wafer Preparation Grinder from Germany

Grinds synthetic sapphire boules for LED/HB-LED wafer production. Statistical notes cover semiconductor materials processing including sapphire substrates.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify sapphire c-plane orientation grinding capability

• Higher hardness requires specialized diamond tooling documentation