Double-Sided Wafer Polisher from Japan
Double-sided polishers simultaneously polish both wafer surfaces to achieve mirror finish and total thickness variation <0.5μm. HTS 8479.30.00.00 per statistical note for critical wafer surface flatness preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include polishing pad conditioning system specs in technical documentation
• Verify endpoint detection system qualifies as integral process control