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8479.30.00.00/Double-Sided Wafer Polisher/Japan

Double-Sided Wafer Polisher from Japan

Double-sided polishers simultaneously polish both wafer surfaces to achieve mirror finish and total thickness variation <0.5μm. HTS 8479.30.00.00 per statistical note for critical wafer surface flatness preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include polishing pad conditioning system specs in technical documentation

• Verify endpoint detection system qualifies as integral process control

Double-Sided Wafer Polisher from Japan — Import Duty Rate | HTS 8479.30.00.00