Double-Sided Wafer Polisher from Germany
Double-sided polishers simultaneously polish both wafer surfaces to achieve mirror finish and total thickness variation <0.5μm. HTS 8479.30.00.00 per statistical note for critical wafer surface flatness preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include polishing pad conditioning system specs in technical documentation
• Verify endpoint detection system qualifies as integral process control