8479.30.00.00/Automated Wafer Polishing Line/Japan

Automated Wafer Polishing Line from Japan

Integrated systems handling wafer loading, lapping, polishing, cleaning in sequence. HTS 8479.30.00.00 for complete wafer preparation equipment per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Classify as single machine if integral control system; separate if modular

• Factory acceptance test videos showing statistical note compliance

• Cleanroom compatibility certification essential