Automated Wafer Polishing Line from Japan
Integrated systems handling wafer loading, lapping, polishing, cleaning in sequence. HTS 8479.30.00.00 for complete wafer preparation equipment per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Classify as single machine if integral control system; separate if modular
• Factory acceptance test videos showing statistical note compliance
• Cleanroom compatibility certification essential