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8475.90.90.00/Wafer Lapping Machine Polishing Pad/Mexico

Wafer Lapping Machine Polishing Pad from Mexico

Specialized polyurethane polishing pad for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. A consumable part under HTS 8475.90.90.00 for wafer preparation apparatus.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Certify pad material and surface finish specs for <1 micron flatness in semiconductor use

• Import in bulk with machine compatibility declaration to prevent parts reclassification