Wafer Lapping Machine Polishing Pad from Mexico
Specialized polyurethane polishing pad for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. A consumable part under HTS 8475.90.90.00 for wafer preparation apparatus.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify pad material and surface finish specs for <1 micron flatness in semiconductor use
• Import in bulk with machine compatibility declaration to prevent parts reclassification