8475.90.90.00/Wafer Lapping Machine Polishing Pad/Japan

Wafer Lapping Machine Polishing Pad from Japan

Specialized polyurethane polishing pad for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. A consumable part under HTS 8475.90.90.00 for wafer preparation apparatus.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify pad material and surface finish specs for <1 micron flatness in semiconductor use

• Import in bulk with machine compatibility declaration to prevent parts reclassification

Wafer Lapping Machine Polishing Pad from Japan — Import Duty Rate | HTS 8475.90.90.00