8475.90.90.00/Wafer Lapping Machine Polishing Pad/Japan

Wafer Lapping Machine Polishing Pad from Japan

Specialized polyurethane polishing pad for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. A consumable part under HTS 8475.90.90.00 for wafer preparation apparatus.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify pad material and surface finish specs for <1 micron flatness in semiconductor use

• Import in bulk with machine compatibility declaration to prevent parts reclassification