8475.90.90.00/Wafer Lapping Machine Polishing Pad/China

Wafer Lapping Machine Polishing Pad from China

Specialized polyurethane polishing pad for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. A consumable part under HTS 8475.90.90.00 for wafer preparation apparatus.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Calculate with your customs value Verify classification with AI

Import Tips

• Certify pad material and surface finish specs for <1 micron flatness in semiconductor use

• Import in bulk with machine compatibility declaration to prevent parts reclassification