Wafer Polishing Machine

Automated polisher that achieves mirror-finish flatness on semiconductor wafers for subsequent fabrication into components of electric lamps and electronic tubes sealed in glass envelopes. HTS 8475.10.00.00 classification reflects its position in the glass envelope assembly workflow.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8479.89.65.00Lower: 20.3% vs 35%

If other semiconductor wafer finishing equipment

Specific wafer polishers for semiconductor manufacture classify under statistical semiconductor provisions.

8460.39.00Higher: 39.4% vs 35%

If general precision polishing without semiconductor function

Non-specialized polishers fall under Chapter 84 machine tools.

7017.90.50.00Higher: 41.7% vs 35%

If for laboratory glassware polishing

Lab-scale glass polishers classify as glassware, not industrial assembly machines.

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Import Tips & Compliance

Technical specs must demonstrate semiconductor surface prep for glass sealing processes

Cross-reference chapter statistical notes excluding Chapter 90 testing polishers