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8474.80.00.80/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

Diamond wire saws slice ultra-thin wafers from monocrystalline silicon boules with minimal material loss. HTS 8474.80.0080 covers this as slicing machinery for semiconductor mineral substances in solid form. Essential wafer preparation equipment per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify diamond wire specs and wafer thickness capabilities (<100μm)

• Include semiconductor fab facility end-user letters

Wafer Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8474.80.00.80