Other
Machinery for sorting, screening, separating, washing, crushing, grinding, mixing or kneading earth, stone, ores or other mineral substances, in solid (including powder or paste) form; machinery for agglomerating, shaping or molding solid mineral fuels, ceramic paste, unhardened cements, plastering materials or other mineral products in powder or paste form; machines for forming foundry molds of sand; parts thereof: > Other machinery > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8474.80.00.80
Crystal Boule Grinder
Crystal boule grinders precisely grind semiconductor crystal ingots to exact diameters and create orientation flats indicating conductivity. Falls under HTS 8474.80.0080 as grinding machinery for solid mineral substances (silicon boules). Prepares crystals for wafer slicing in semiconductor fabrication.
Silicon Wafer Lapper
Wafer lappers use loose abrasives to achieve flatness tolerances on silicon wafers prior to polishing. Classified HTS 8474.80.0080 for grinding/lapping solid semiconductor mineral substances. Meets statistical note for wafer preparation equipment.
CMP Wafer Polisher
Chemical Mechanical Polishers (CMP) planarize silicon wafers using slurry and polishing pads for device fabrication readiness. Under HTS 8474.80.0080 as polishing machinery for semiconductor mineral wafers. Final wafer preparation step per statistical notes.
Silicon Ingot Grinder
Precision grinders shape silicon ingots to uniform diameter with orientation flats for conductivity indication. HTS 8474.80.0080 for grinding solid semiconductor crystal boules. Wafer manufacturing equipment per statistical note (a)(ii)(A).
Gallium Arsenide Wafer Slicer
Specialized saws slice compound semiconductor wafers from GaAs boules with minimal subsurface damage. Classified HTS 8474.80.0080 for processing solid mineral semiconductor substances. Covers compound semis per statistical notes.
Wafer Edge Grinder
Edge grinders chamfer wafer peripheries to prevent chipping during handling and processing. HTS 8474.80.0080 grinding machinery for semiconductor wafers. Improves yield in wafer fabrication.
Crystal boule orientation grinder
Grinds precise flats on semiconductor boules indicating crystal orientation and doping type. HTS 8474.80.0080 for grinding mineral substances. Statistical note crystal grinder equipment.
Czochralski Crystal Puller
A Czochralski crystal puller is used to grow monocrystalline silicon boules from molten semiconductor material by slowly pulling a seed crystal. It falls under HTS 8474.80.0080 as machinery for processing semiconductor materials, classified as grinding or other mineral substance processing equipment in solid form. This equipment is essential for wafer manufacturing in semiconductor production.
Float Zone Crystal Grower
Float zone crystal growers produce high-purity silicon crystals using the float zone method, melting and recrystallizing a polycrystalline rod. Classified under HTS 8474.80.0080 for processing semiconductor materials in solid form via heating and zone refining techniques akin to mineral grinding. Critical for oxygen-free silicon wafers.
Wafer Slicing Diamond Saw
Diamond wire saws slice ultra-thin wafers from monocrystalline silicon boules with minimal material loss. HTS 8474.80.0080 covers this as slicing machinery for semiconductor mineral substances in solid form. Essential wafer preparation equipment per statistical notes.